Patent Assignment
Reel/Frame 052828/0982
Assignment of Assignor's Interest
Recorded: 2020-06-03
Pages: 3
Assignors
HO, TSAI-JUNG
Executed: 2020-05-15
WANG, YU-SHIH
Executed: 2020-05-15
LEE, TZE-LIANG
Executed: 2020-05-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Device That Includes Covering Metal Gate with Multilayer Dielectric