Patent Assignment
Reel/Frame 052841/0596
Assignment of Assignor's Interest
Recorded: 2020-06-04
Pages: 3
Assignor
CHEN, CHIEN-CHIH
Executed: 2020-05-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Patterning Process of a Semiconductor Structure with Enhanced Adhesion