Patterning process of a semiconductor structure with enhanced adhesion

1. A method, comprising:

forming a bottom anti-reflective coating (BARC) layer on a substrate, wherein the BARC layer includes an organic polymer and a reactive chemical group having at least one of chelating ligands and capping monomers, wherein the reactive chemical group is bonded to the organic polymer;

coating a metal-containing photoresist (MePR) layer on the BARC layer, wherein the MePR being sensitive to an extreme ultraviolet (EUV) radiation;

performing a first baking process to the MePR layer and the BARC layer, thereby reacting a metal chemical structure of the MePR layer and the reactive chemical group of the BARC layer and forming an interface layer between the MePR layer and the BARC layer;

performing an exposure process using the EUV radiation to the MePR layer; and

developing the MePR layer to form a patterned photoresist layer.

2. The method of claim 1 , further comprising performing a first etching process to transfer a pattern of the patterned photoresist layer to an under layer on the substrate.

3. The method of claim 1 , wherein the organic polymer includes at least one of Polystyrene (PS), Poly-hydroxy-styrene (PHS) resin polymer, Poly(methyl methacrylate) (PMMA), and poly(methyl acrylate) (PMA).

4. The method of claim 3 , wherein the reactive chemical group includes at least one of Monodentate, Bidentate, Tridentate, Hexadentate and a combination thereof.

5. The method of claim 1 , wherein the BARC layer further includes photoacid generators (PAGs) bonded to the organic polymer of the BARC layer.

6. The method of claim 5 , wherein

the PAGs include triphenylsulfonium triflate; and

the reactive chemical group includes

7. The method of claim 1 , wherein the interface layer is chemically boned to the MePR layer and the organic polymer of the BARC layer.

8. The method of claim 7 , wherein the interface layer includes a metal selected from the group consisting of tin (Sn), cobalt (Co), nickel (Ni), iron (Fe), ruthenium (Ru), and rhodium (Rh).

9. The method of claim 7 , wherein the interface layer has a thickness ranging between 0.5 nm and 2 nm.

10. The method of claim 1 , further comprising performing a second baking process to the BARC layer prior to the coating of the MePR layer, wherein the second baking process has a baking temperature greater than that of the first baking process.

11. The method of claim 1 , wherein the first baking process causes the BARC layer and the MePR layer to have a dehydration reaction between the metal chemical structure and the reactive chemical group.

12. The method of claim 1 , wherein the first baking process causes the BARC layer and the MePR layer to have a condensation reaction between the metal chemical structure and the reactive chemical group.

13. A method, comprising:

forming an under layer on a semiconductor substrate;

forming a bottom anti-reflective coating (BARC) layer on the under layer, wherein the BARC layer includes an organic polymer, fluoro-containing photoacid generator (PAG), and a reactive chemical group having at least one of chelating ligands and capping monomers, wherein the reactive chemical group and fluoro-containing PAG are bonded to the organic polymer;

coating a metal-containing photoresist (MePR) layer on the BARC layer, wherein the MePR being sensitive to an extreme ultraviolet (EUV) radiation;

performing a baking process to the MePR layer and the BARC layer, thereby reacting a metal of the MePR layer and the reactive chemical group of the BARC layer to form an interface layer between the MePR layer and the BARC layer, wherein the interface layer includes a chemical bond between the metal and the reactive chemical group;

performing an exposure process using the EUV radiation to the MePR layer; and

developing the MePR layer to form a patterned photoresist layer.

14. The method of claim 13 , further comprising performing a first etching process to transfer a pattern of the patterned photoresist layer to the under layer on the substrate.

15. The method of claim 13 , wherein

the organic polymer includes at least one of Polystyrene (PS), Poly-hydroxy-styrene (PHS) resin polymer, Poly (methyl methacrylate) (PMMA), and poly (methyl acrylate) (PMA);

the reactive chemical group includes at least one of Monodentate, Bidentate, Tridentate, Hexadentate and a combination thereof; and

the PAGs include triphenylsulfonium triflate.

16. The method of claim 15 , wherein the interface layer includes a metal selected from the group consisting of tin (Sn), cobalt (Co), nickel (Ni), iron (Fe), ruthenium (Ru), and rhodium (Rh).

17. The method of claim 13 , wherein the interface layer has a thickness ranging between 0.5 nm and 2 nm.

18. The method of claim 13 , wherein the baking process to the MePR layer and the BARC layer is a first baking process, the method further comprising performing a second baking process to the BARC layer before the coating of the MePR layer, wherein the second baking process has a baking temperature greater than that of the first baking process.

19. A method, comprising:

forming a bottom anti-reflective coating (BARC) layer on the semiconductor substrate, wherein the BARC layer includes an organic polymer, fluoro-containing photoacid generator (PAG), and a reactive chemical group having at least one of chelating ligands and capping monomers, wherein the reactive chemical group and fluoro-containing PAG are bonded to the organic polymer;

coating a metal-containing photoresist (MePR) layer on the BARC layer, wherein the MePR being sensitive to an extreme ultraviolet (EUV) radiation;

performing a baking process to the MePR layer and the BARC layer, thereby reacting a metal of the MePR layer and the reactive chemical group of the BARC layer to form a chemical bond between the metal and the reactive chemical group;

performing an exposure process using the EUV radiation to the MePR layer; and

developing the MePR layer to form a patterned photoresist layer.

20. The method of claim 19 , wherein

the organic polymer includes at least one of Polystyrene (PS), Poly-hydroxy-styrene (PHS) resin polymer, Poly (methyl methacrylate) (PMMA), and poly (methyl acrylate) (PMA);

the reactive chemical group includes at least one of Monodentate, Bidentate, Tridentate, Hexadentate and a combination thereof;

the PAGs include triphenylsulfonium triflate; and

the MePR layer includes