Patent Assignment
Reel/Frame 052894/0158
Assignment of Assignor's Interest
Recorded: 2020-06-10
Pages: 3
Assignors
IIJIMA, NOBUYUKI
Executed: 2020-04-21
YANAGISAWA, HIROHARU
Executed: 2020-04-21
NAKAMURA, YUICHI
Executed: 2020-04-21
TAKAHASHI, RYUJI
Executed: 2020-04-21
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Substrate Fixing Apparatus Including a Base Plate, an Electrostatic Adsorption Member, a Plurality of Support Members on the Base Plate and Supporting the Electrostatic Adsorption Member, and an Adhesive Layer Bonding the Electrostatic Adsorption Member to the Base Plate