Patent Assignment
Reel/Frame 052899/0811
Assignment of Assignor's Interest
Recorded: 2020-06-10
Pages: 5
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Separation Method and Assembly for Chip-on-Wafer Processing