Patent Assignment
Reel/Frame 052902/0210
Assignment of Assignor's Interest
Recorded: 2020-06-11
Pages: 5
Assignors
CHEN, MING-FA
Executed: 2020-05-25
WU, NIEN-FANG
Executed: 2020-05-19
YEH, SUNG-FENG
Executed: 2020-05-22
LIU, TZUAN-HORNG
Executed: 2020-05-19
SHIH, CHAO-WEN
Executed: 2020-05-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same