Patent Assignment
Reel/Frame 052936/0024
Assignment of Assignor's Interest
Recorded: 2020-06-15
Pages: 6
Assignors
CHOI, HYUNHO
Executed: 2020-06-01
KIM, JUNGHOON
Executed: 2020-06-01
LEE, DONGHYOUCK
Executed: 2020-06-01
LEE, JAEHYUNG
Executed: 2020-06-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Processing Apparatus and Wafer Processing Method