Patent Assignment
Reel/Frame 052970/0297
Assignment of Assignor's Interest
Recorded: 2020-06-18
Pages: 4
Assignors
CHEN, MING-FA
Executed: 2020-04-27
YEH, SUNG-FENG
Executed: 2020-04-27
LIU, TZUAN-HORNG
Executed: 2020-04-24
SHIH, CHAO-WEN
Executed: 2020-04-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structures and Methods of Fabricating the Same