Patent Assignment
Reel/Frame 052972/0445
Assignment of Assignor's Interest
Recorded: 2020-06-18
Pages: 6
Assignors
WON, DONGHOON
Executed: 2020-06-08
LEE, JAEEUN
Executed: 2020-06-08
KO, YEONGKWON
Executed: 2020-06-08
HEO, JUNYEONG
Executed: 2020-06-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Substrate and Method of Dicing the Same