IP Library › Assignment 052992/0228
Patent Assignment
Reel/Frame 052992/0228

Assignment of Assignor's Interest

Recorded: 2020-06-19 Pages: 2
Assignors
CHAN, HONG-WEI
Executed: 2020-06-09
CHENG, YUNG-SHIH
Executed: 2020-06-09
HUANG, WEN-SHEH
Executed: 2020-06-09
CHENG, YU-HSIANG
Executed: 2020-06-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Interconnect Level with High Resistance Layer and Method of Forming the Same
Application: 16/906,659 →
Publication: US 2021/0257295
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Conveying Party Data Previously Recorded on Reel 052992 Frame 0228. Assignor(S) Hereby Confirms the Assignment of Assignors' Interest. Jul 26, 2022
From: CHAN, HONG-WEI; CHENG, YUNG-SHIH; HUANG, WEN-SHEH; CHEN, YU-HSIANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 060919/0008 →