Corrective Assignment to Correct the Conveying Party Data Previously Recorded on Reel 052992 Frame 0228. Assignor(S) Hereby Confirms the Assignment of Assignors' Interest.

Recorded: 2022-07-26 Pages: 5

Assignors

CHAN, HONG-WEI

Executed: 2022-07-17

CHENG, YUNG-SHIH

Executed: 2022-07-25

HUANG, WEN-SHEH

Executed: 2022-07-17

CHEN, YU-HSIANG

Executed: 2022-07-18

Assignee

8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN

Covered Property (1)

Interconnect Level with High Resistance Layer and Method of Forming the Same

Patent: 11,923,295 →

Application: 16/906,659 →

Publication: US 2021/0257295

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.