Patent Assignment
Reel/Frame 053037/0886
Assignment of Assignor's Interest
Recorded: 2020-06-25
Pages: 6
Assignors
BAI, SIPING
Executed: 2018-05-03
WU, XIANGLAN
Executed: 2018-05-03
WANG, ZHIJIAN
Executed: 2018-05-03
YANG, ZHIGANG
Executed: 2018-05-03
ZHANG, JINQIANG
Executed: 2018-05-03
Assignee
RICHVIEW ELECTRONICS CO., LTD.
ROOM#8078, 8F, HI-TECH BUILDING, NO. 2, JIAYUAN ROAD, EAST LAKE HI-TECH DEVELOPMENT ZONE, WUHAN, 430074, CHINA
Covered Property
(1)
Single-Layer Circuit Board, Multi-Layer Circuit Board, and Manufacturing Methods Therefor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.