Patent Assignment
Reel/Frame 053102/0585
Assignment of Assignor's Interest
Recorded: 2020-07-01
Pages: 6
Assignors
LIN, YAOJIAN
Executed: 2013-12-18
MARIMUTHU, PANDI C.
Executed: 2013-12-18
SHIM, IL KWON
Executed: 2013-12-18
HAN, BYUNG JOON
Executed: 2013-12-18
Assignee
STATS CHIPPAC PTE. LTD., FORMERLY STATS CHIPPAC, LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Correct Error in Assignment Name from Stats Chippac, Pte. Lte to Stats Chippac Pte. Ltd (Reel: 038378 Frame: 0319)
Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064760/0986 →
Corrective Assignment to Correct the the Assignee Name Previously Recorded at Reel: 053102 Frame: 0585. Assignor(S) Hereby Confirms the Assignment.
Oct 16, 2023
From: LIN, YAOJIAN; MARIMUTHU, PANDI C.; SHIM, IL KWON; HAN, BYUNG JOON
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 065673/0685 →