Patent Assignment
Reel/Frame 065673/0685
Corrective Assignment to Correct the the Assignee Name Previously Recorded at Reel: 053102 Frame: 0585. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2023-10-16
Pages: 8
Assignors
LIN, YAOJIAN
Executed: 2013-12-18
MARIMUTHU, PANDI C.
Executed: 2013-12-18
SHIM, IL KWON
Executed: 2013-12-18
HAN, BYUNG JOON
Executed: 2013-12-18
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 1, 2020
From: LIN, YAOJIAN; MARIMUTHU, PANDI C.; SHIM, IL KWON; HAN, BYUNG JOON
To: STATS CHIPPAC PTE. LTD., FORMERLY STATS CHIPPAC, LTD.
Reel/Frame 053102/0585 →
Correct Error in Assignment Name from Stats Chippac, Pte. Lte to Stats Chippac Pte. Ltd (Reel: 038378 Frame: 0319)
Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064760/0986 →