Patent Assignment
Reel/Frame 053143/0857
Assignment of Assignor's Interest
Recorded: 2020-07-07
Pages: 6
Assignors
TSENG, CHI SHENG
Executed: 2020-02-20
LAI, LU-MING
Executed: 2020-02-20
HUANG, CHING-HAN
Executed: 2020-02-20
LAI, KUO-HUA
Executed: 2020-02-20
LIU, HUI-CHUNG
Executed: 2020-02-20
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method of Manufacturing the Same