Patent Assignment
Reel/Frame 053170/0033
Assignment of Assignor's Interest
Recorded: 2020-07-10
Pages: 4
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING KOREA, INC.
76, SANEOPDANJI-GIL, PAJU-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same