Patent Assignment
Reel/Frame 053171/0650
Assignment of Assignor's Interest
Recorded: 2020-07-09
Pages: 7
Assignors
PARK, DONG JOO
Executed: 2008-12-23
KIM, JIN SEONG
Executed: 2008-12-23
LEE, KI WOOK
Executed: 2008-12-23
KANG, DAE BYOUNG
Executed: 2009-01-02
CHOI, HO
Executed: 2008-12-23
KIM, KWANG HO
Executed: 2008-12-23
KIM, JAE DONG
Executed: 2008-12-23
JUNG, YEON SOO
Executed: 2008-12-20
CHO, SUNG HWAN
Executed: 2008-12-23
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. TECHNOLOGY CIRCLE, TEMPE, ARIZONA, 85284
Covered Properties
(2)
Semiconductor Device with Through-Mold Via
Application:
15/390,568 →
Publication:
US 2017/0117214
Semiconductor Device with Through-Mold Via
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Mar 28, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD.
Reel/Frame 052253/0594 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →