Patent Assignment
Reel/Frame 053177/0545
Assignment of Assignor's Interest
Recorded: 2020-07-10
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2020-06-15
HSIEH, WEI-KANG
Executed: 2020-06-15
CHEN, SHIH-WEI
Executed: 2020-06-15
KUO, TIN-HAO
Executed: 2020-06-12
TSAI, HAO-YI
Executed: 2020-06-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chamfered Die of Semiconductor Package and Method for Forming the Same