IP Library Assignment 053200/0789
Patent Assignment
Reel/Frame 053200/0789

Assignment of Assignor's Interest

Recorded: 2020-07-14 Pages: 7
Assignors
LIU, FU-CHOU
Executed: 2020-07-10
LEE, CHIEN-CHEN
Executed: 2020-06-01
HUNG, LI-CHUN
Executed: 2020-06-01
CHANG, YA-HAN
Executed: 2020-07-10
Assignee
KINGPAK TECHNOLOGY INC.
NO.84, TAI-HO RD., CHU-PEI,, HSIN-CHU COUNTY, 302, TAIWAN
Covered Property (1)
Chip-Scale Sensor Package Structure
Application: 16/928,193 →
Publication: US 2021/0305304
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Dec 14, 2022
From: KINGPAK TECHNOLOGY INC.
To: TONG HSING ELECTRONIC INDUSTRIES, LTD.
Reel/Frame 062119/0661 →