Patent Assignment
Reel/Frame 053209/0303
Assignment of Assignor's Interest
Recorded: 2020-07-15
Pages: 4
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK,, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Semiconductor Device Including Uneven Contact in Passivation Layer and Method of Manufacturing the Same