Patent Assignment
Reel/Frame 053216/0831
Assignment of Assignor's Interest
Recorded: 2020-07-15
Pages: 5
Assignee
SUMCO CORPORATION
2-1, SHIBAURA, 1-CHOME, MINATO-KU, TOKYO, 1058634, JAPAN
Covered Property
(1)
Method of Producing Bonded Wafer and Bonded Wafer