Patent Assignment
Reel/Frame 053222/0470
Assignment of Assignor's Interest
Recorded: 2020-07-15
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Packages Comprising a Plurality of Redistribution Structures and Methods of Forming the Same