Patent Assignment
Reel/Frame 053234/0403
Assignment of Assignor's Interest
Recorded: 2020-07-16
Pages: 4
Assignors
CHEN, HSIEN-WEI
Executed: 2020-07-09
CHEN, JIE
Executed: 2020-07-09
CHEN, MING-FA
Executed: 2020-07-09
JAN, SEN-BOR
Executed: 2020-07-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Having Different Metal Densities in Different Regions and Manufacturing Method Thereof