Patent Assignment
Reel/Frame 053332/0741
Assignment of Assignor's Interest
Recorded: 2020-07-28
Pages: 8
Assignors
LIN, YUSHENG
Executed: 2018-03-13
CARNEY, FRANCIS J.
Executed: 2018-03-14
NOMA, TAKASHI
Executed: 2018-03-12
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Thinned Semiconductor Package and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 25, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054523/0378 →
Release of Security Interest in Patents Previously Recorded at Reel 054523, Frame 0378
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0602 →