Patent Assignment
Reel/Frame 053339/0927
Assignment of Assignor's Interest
Recorded: 2020-07-29
Pages: 6
Assignors
PENG, CHENG-YI
Executed: 2018-08-30
LU, CHUN-CHIEH
Executed: 2018-08-30
HSIAO, MENG-HSUAN
Executed: 2018-08-30
YEH, LING-YEN
Executed: 2018-09-08
DIAZ, CARLOS H.
Executed: 2018-08-29
LEE, TUNG-YING
Executed: 2018-08-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method for Forming Integrated Semiconductor Device with 2D Material Layer