Patent Assignment
Reel/Frame 053339/0971
Assignment of Assignor's Interest
Recorded: 2020-07-29
Pages: 4
Assignors
SU, CHIA-WEI
Executed: 2018-08-22
YEN, FU-TING
Executed: 2018-08-17
CHEN, TING-TING
Executed: 2018-08-22
TSAI, TENG-CHUN
Executed: 2018-08-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof