Patent Assignment
Reel/Frame 053341/0210
Assignment of Assignor's Interest
Recorded: 2020-07-29
Pages: 4
Assignors
YEH, SHU-SHEN
Executed: 2020-07-07
LIN, PO-YAO
Executed: 2020-07-17
JENG, SHIN-PUU
Executed: 2020-07-07
LAI, PO-CHEN
Executed: 2020-07-07
LEE, KUANG-CHUN
Executed: 2020-07-07
YANG, CHE-CHIA
Executed: 2020-07-07
WANG, CHIN-HUA
Executed: 2020-07-07
LIN, YI-HANG
Executed: 2020-07-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure with Ring Structure and Method for Forming the Same