IP Library Assignment 053360/0614
Patent Assignment
Reel/Frame 053360/0614

Assignment of Assignor's Interest

Recorded: 2020-07-30 Pages: 4
Assignors
ZHAO, LEI
Executed: 2020-07-28
RADULESCU, FABIAN
Executed: 2020-07-29
Assignee
CREE, INC.
4600 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Property (1)
Die-To-Die Isolation Structures for Packaged Transistor Devices
Application: 16/944,002 →
Publication: US 2022/0037464
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 24, 2022
From: CREE, INC.
To: WOLFSPEED, INC.
Reel/Frame 058823/0351 →
Assignment of Assignor's Interest Dec 29, 2023
From: WOLFSPEED, INC.
To: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 066236/0086 →