Patent Assignment
Reel/Frame 058823/0351
Change of Name
Recorded: 2022-01-24
Pages: 6
Assignor
CREE, INC.
Executed: 2021-10-01
Assignee
WOLFSPEED, INC.
4600 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Properties
(56)
Stabilized, High-Doped Silicon Carbide
Semiconductor Devices Having Unit Cell Transistors with Smoothed Turn-on Behavior and Improved Linearity
Bypassed Gate Transistors Having Improved Stability
Monolithic Microwave Integrated Circuits Having Both Enhancement-Mode and Depletion Mode Transistors
Drain and/or Gate Interconnect and Finger Structure
Transistor Level Input and Output Harmonic Terminations
Packaged Transistor Devices with Input-Output Isolation and Methods of Forming Packaged Transistor Devices with Input-Output Isolation
High Electron Mobility Transistors Having Improved Drain Current Drift and/or Leakage Current Performance
High Power Transistor with Interior-Fed Fingers
In-Transistor Load Modulation
High Reliability Semiconductor Devices and Methods of Fabricating the Same
Radio Frequency Amplifiers Having Improved Shunt Matching Circuits
Semiconductor Device Having a First Barrier Layer Formed on a Gate Pad and Gate Electrode and an Isolation Layer Provided Between the First Barrier Layer and a Second Barrier Layer Formed Thereon
Application:
16/863,642 →
Publication:
US US20210343847A1
Group Iii Nitride-Based Radio Frequency Amplifiers Having Back Side Source, Gate and/or Drain Terminals
Multi Level Radio Frequency (Rf) Integrated Circuit Components Including Passive Devices
Trenched Power Device with Segmented Trench and Shielding
Conduction Enhancement Layers for Electrical Contact Regions in Power Devices
Radio Frequency (Rf) Transistor Amplifier Packages with Improved Isolation and Lead Configurations
Packaging for Rf Transistor Amplifiers
Radio Frequency Transistor Amplifiers Having Leadframes with Integrated Shunt Inductors and/or Direct Current Voltage Source Inputs
Stacked Rf Circuit Topology
Methods for Pillar Connection on Frontside and Passive Device Integration on Backside of Die
Wideband Rf Short/Dc Block Circuit for Rf Devices and Applications
Stacked Rf Circuit Topology Using Transistor Die with Through Silicon Carbide Vias on Gate and/or Drain
Rf Amplifier Devices Including Interconnect Structures and Methods of Manufacturing
Rf Amplifier Devices Including Top Side Contacts and Methods of Manufacturing
Radio Frequency Transistor Amplifiers Having Multi-Layer Encapsulations That Include Functional Electrical Circuits
Die-To-Die Isolation Structures for Packaged Transistor Devices
Sidewall Dopant Shielding Methods and Approaches for Trenched Semiconductor Device Structures
Rf Amplifiers Having Shielded Transmission Line Structures
Transistor Packages with Improved Die Attach
Power Silicon Carbide Based Semiconductor Devices with Improved Short Circuit Capabilities and Methods of Making Such Devices
Multi-Zone Radio Frequency Transistor Amplifiers
Packaged Rf Power Device with Pcb Routing Outside Protective Member
Power Semiconductor Devices Including a Trenched Gate and Methods of Forming Such Devices
Semiconductor Power Devices Having Multiple Gate Trenches and Methods of Forming Such Devices
Semiconductor Devices Including an Offset Metal to Polysilicon Gate Contact
Application:
17/096,147 →
Publication:
US US20220149165A1
Gate Trench Power Semiconductor Devices Having Improved Deep Shield Connection Patterns
Gate Trench Power Semiconductor Devices Having Improved Deep Shield Connection Patterns
Radio Frequency Transistor Amplifiers Having Widened and/or Asymmetric Source/Drain Regions for Improved on-Resistance Performance
Finfet Power Semiconductor Devices
Packaged Electronic Devices Having Dielectric Substrates with Thermally Conductive Adhesive Layers
Semiconductor Devices Having Gate Resistors with Low Variation in Resistance Values
High Output Power Density Radio Frequency Transistor Amplifiers in Flat No-Lead Overmold Packages
Bias Circuits and Improved Linearity Bias Schemes for Rf Power Devices
Patent:
11,281,245 →
Application:
17/159,825 →
Output-Integrated Transistor Amplifier Device Packages Incorporating Internal Connections
High Electron Mobility Transistors Having Improved Performance
Transistors Including Semiconductor Surface Modification and Related Fabrication Methods
Methods of Manufacturing High Electron Mobility Transistors Having a Modified Interface Region
Encapsulation Stack for Improved Humidity Performance and Related Fabrication Methods
Interconnect Metal Openings Through Dielectric Films
Multilayer Encapsulation for Humidity Robustness and Related Fabrication Methods
Output-Integrated Transistor Device Packages
Packaged Transistor Amplifiers That Include Integrated Passive Device Matching Structures Having Distributed Shunt Inductances
Wide Bandgap Field Effect Transistors with Source Connected Field Plates
Wide bandgap transistors with gate-source field plates
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 28, 2019
From: MOKHTI, ZULHAZMI A.; TRANG, FRANK; JANG, HAEDONG
To: CREE, INC.
Reel/Frame 048726/0376 →
Assignment of Assignor's Interest
Apr 24, 2019
From: TRANG, FRANK; MOKHTI, ZULHAZMI; JANG, HAEDONG
To: CREE, INC.
Reel/Frame 048984/0034 →
Assignment of Assignor's Interest
May 24, 2019
From: JOO, SUNG CHUL; KOMPOSCH, ALEXANDER; CONDIE, BRIAN WILLIAM; LAW, BENJAMIN
To: CREE, INC.
Reel/Frame 049277/0084 →
Assignment of Assignor's Interest
Jan 8, 2020
From: WARD, SIMON; WILSON, RICHARD; KOMPOSCH, ALEXANDER
To: CREE, INC.
Reel/Frame 051451/0050 →
Assignment of Assignor's Interest
Apr 30, 2020
From: LICHTENWALNER, DANIEL JENNER
To: CREE, INC.
Reel/Frame 052541/0181 →
Assignment of Assignor's Interest
Oct 13, 2020
From: LICHTENWALNER, DANIEL JENNER; KIM, WOONGSUN
To: CREE, INC.
Reel/Frame 054041/0032 →
Confirmatory Assignment
Jan 11, 2021
From: WILSON, RICHARD
To: CREE, INC.
Reel/Frame 054944/0455 →
Assignment of Assignor's Interest
Jan 19, 2021
From: CHIDURALA, MADHU
To: CREE, INC.
Reel/Frame 054957/0237 →
Assignment of Assignor's Interest
Feb 9, 2021
From: LICHTENWALNER, DANIEL JENNER; VAN BRUNT, EDWARD ROBERT
To: CREE, INC.
Reel/Frame 055199/0059 →
Assignment of Assignor's Interest
Mar 24, 2021
From: WATTS, MICHAEL E.; BOKATIUS, MARIO; KIM, JANGHEON; MU, QIANLI
To: CREE, INC.
Reel/Frame 055703/0753 →
Assignment of Assignor's Interest
Jan 21, 2022
From: FAYED, KHALED; WOOD, SIMON
To: CREE, INC.
Reel/Frame 058718/0360 →
Assignment of Assignor's Interest
Jan 21, 2022
From: LEE, KYOUNG-KEUN; RADULESCU, FABIAN; SHEPPARD, SCOTT
To: CREE, INC.
Reel/Frame 058718/0001 →
Assignment of Assignor's Interest
Jan 21, 2022
From: POWELL, ADRIAN; BURK, AL; O'LOUGHLIN, MICHAEL
To: CREE, INC.
Reel/Frame 058718/0017 →
Assignment of Assignor's Interest
Jan 21, 2022
From: LIU, YUEYING; SRIRAM, SAPTHARISHI; SHEPPARD, SCOTT; GAO, JENNIFER
To: CREE, INC.
Reel/Frame 058718/0106 →
Assignment of Assignor's Interest
Jan 21, 2022
From: TRANG, FRANK; JANG, HAEDONG; MOKHTI, ZULHAZMI
To: CREE, INC.
Reel/Frame 058718/0157 →
Assignment of Assignor's Interest
Jan 21, 2022
From: SRIRAM, SAPTHARISHI; GAO, JENNIFER; FISHER, JEREMY; SHEPPARD, SCOTT
To: CREE, INC.
Reel/Frame 058718/0483 →
Assignment of Assignor's Interest
Jan 21, 2022
From: TRANG, FRANK; MOKHTI, ZULHAZMI; JANG, HAEDONG
To: CREE, INC.
Reel/Frame 058718/0547 →
Assignment of Assignor's Interest
Jan 21, 2022
From: TRANG, FRANK; MOKHTI, ZULHAZMI; BIGNY, GUILLAUME
To: CREE, INC.
Reel/Frame 058718/0711 →
Security Interest
Jun 30, 2023
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION
Reel/Frame 064185/0755 →
Change of Name
Aug 16, 2023
From: CREE, INC.
To: WOLFSPEED, INC.
Reel/Frame 064615/0365 →
Assignment of Assignor's Interest
Aug 18, 2023
From: TRANG, FRANK; MOKHTI, ZULHAZMI; JANG, HAEDONG
To: CREE, INC.
Reel/Frame 064635/0149 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 64185/0755
Dec 4, 2023
From: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WOLFSPEED, INC.
Reel/Frame 065758/0625 →
Assignment of Assignor's Interest
Dec 29, 2023
From: WOLFSPEED, INC.
To: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 066236/0086 →
Release of Security Interest in Intellectual Property Collateral at Reel/Frame No. 64185/0755
Sep 30, 2025
From: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WOLFSPEED, INC.
Reel/Frame 072989/0001 →
Notice of Grant of Security Interest in Intellectual Property
Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0113 →