Radio frequency transistor amplifiers having multi-layer encapsulations that include functional electrical circuits
RF transistor amplifiers are provided that include a submount and an RF transistor amplifier die that is mounted on top of the submount. A multi-layer encapsulation is formed that at least partially covers the RF transistor amplifier die. The multi-layer encapsulation includes a first dielectric layer and a first conductive layer, where the first dielectric layer is between a top surface of the RF transistor amplifier die and the first conductive layer.
1. A radio frequency (“RF”) transistor amplifier, comprising:
a submount;
an RF transistor amplifier die mounted on top of the submount; and
a multi-layer encapsulation that at least partially covers the RF transistor amplifier die,
wherein the multi-layer encapsulation includes a first dielectric layer and a first conductive layer,
wherein the first dielectric layer is between a top surface of the RF transistor amplifier die and the first conductive layer, and
wherein the first dielectric layer is on a side surface of the RF transistor amplifier die.
2. A radio frequency (“RF”) transistor amplifier, comprising:
a submount;
an RF transistor amplifier die mounted on top of the submount; and
a multi-layer encapsulation that at least partially covers the RF transistor amplifier die,
wherein the multi-layer encapsulation includes a first dielectric layer and a first conductive layer,
wherein the first dielectric layer is between a top surface of the RF transistor amplifier die and the first conductive layer,
wherein the multi-layer encapsulation further includes a second dielectric layer, and wherein at least part of the first conductive layer is sandwiched between the first dielectric layer and the second dielectric layer.
3. A radio frequency (“RF”) transistor amplifier, comprising:
a submount;
an RF transistor amplifier die mounted on top of the submount; and
a multi-layer encapsulation that at least partially covers the RF transistor amplifier die,
wherein the multi-layer encapsulation includes a first dielectric layer and a first conductive layer,
wherein the first dielectric layer is between a top surface of the RF transistor amplifier die and the first conductive layer,
wherein the first conductive layer is positioned to reduce coupling between an RF input connection to the RF transistor amplifier die and an RF output connection to the RF transistor amplifier die.
4. The RF transistor amplifier of claim 1 , wherein the first conductive layer is configured to reduce an inductance of a bond wire connection to the RF transistor amplifier die.
5. The RF transistor amplifier of claim 1 , wherein the first conductive layer comprises an antenna element that is electrically coupled to an output of the RF transistor amplifier die.
6. The RF transistor amplifier of claim 1 , wherein the RF transistor amplifier is mounted on an RF board, and the first conductive layer is electrically connected to the RF board.
7. A radio frequency (“RF”) transistor amplifier, comprising:
an RF transistor amplifier die; and
an encapsulation that at least partially encapsulates the RF transistor amplifier die,
wherein the encapsulation includes a first dielectric layer that at least partially encapsulates the RF transistor amplifier die and an electrical circuit that is formed on the first dielectric layer opposite the RF transistor amplifier die, and
wherein the electrical circuit includes at least one of a capacitor, an inductor, and/or an antenna element.
8. The RF transistor amplifier of claim 7 , wherein the electrical circuit comprises an impedance matching circuit.
9. The RF transistor amplifier of claim 7 , wherein the electrical circuit comprises an interdigitated finger capacitor.
10. A radio frequency (“RF”) transistor amplifier, comprising:
an RF transistor amplifier die; and
an encapsulation that at least partially encapsulates the RF transistor amplifier die,
wherein the encapsulation includes a first dielectric layer that at least partially encapsulates the RF transistor amplifier die and an electrical circuit that is formed on the first dielectric layer opposite the RF transistor amplifier die,
wherein the electrical circuit comprises a grounded conductive layer that is positioned to reduce coupling between an RF input connection to the RF transistor amplifier die and an RF output connection to the RF transistor amplifier die.
11. The RF transistor amplifier of claim 10 , wherein the encapsulation further includes a first conductive layer, and wherein at least part of the electrical circuit is implemented in the first conductive layer.
12. The RF transistor amplifier of claim 11 , wherein the first conductive layer is configured to reduce coupling between the RF input connection and the RF output connection.
13. A radio frequency (“RF”) transistor amplifier, comprising:
an RF transistor amplifier die; and
an encapsulation that at least partially encapsulates the RF transistor amplifier die,
wherein the encapsulation includes a first dielectric layer that at least partially encapsulates the RF transistor amplifier die and an electrical circuit that is formed on the first dielectric layer opposite the RF transistor amplifier die,
wherein the electrical circuit in the encapsulation is electrically connected to an external circuit through at least one bond wire.
14. The RF transistor amplifier of claim 7 , wherein the electrical circuit comprises the antenna element, and the antenna element is electrically coupled to an output of the RF transistor amplifier die.
15. A radio frequency (“RF”) transistor amplifier, comprising:
an RF transistor amplifier die;
a plurality of bond wires electrically connecting the RF transistor amplifier die to an external circuit; and
a multi-layer encapsulation that at least partially encapsulates the RF transistor amplifier die,
wherein the multi-layer encapsulation includes a grounded conductive layer positioned immediately adjacent at least one of the bond wires.
16. The RF transistor amplifier of claim 15 , wherein the grounded conductive layer is configured to reduce coupling between an input and an output of the RF transistor amplifier.
17. The RF transistor amplifier of claim 15 , wherein the grounded conductive layer is configured to reduce an inductance of a bond wire connection to the RF transistor amplifier die.
18. The RF transistor amplifier of claim 15 , wherein the multi-layer encapsulation includes a first dielectric layer that at least partially encapsulates the RF transistor amplifier die and the grounded conductive layer is on the first dielectric layer opposite the RF transistor amplifier die.
19. The RF transistor amplifier of claim 18 , wherein the grounded conductive layer extends along a sidewall of the first dielectric layer to physically contact a metal pad on an underlying printed circuit board.
20. The RF transistor amplifier of claim 15 , wherein the grounded conductive layer includes a first metal pattern that extends above an input terminal of the RF transistor amplifier die and a second metal pattern that extends above an output terminal of the RF transistor amplifier die.