High reliability semiconductor devices and methods of fabricating the same
A semiconductor device package includes a substrate, a silicon (Si) or silicon carbide (SiC) semiconductor die, and a metal layer on a surface of the semiconductor die. The metal layer includes a bonding surface that is attached to a surface of the substrate by a die attach material. The bonding surface includes opposing edges that extend along a perimeter of the semiconductor die, and one or more non-orthogonal corners that are configured to reduce stress at an interface between the bonding surface and the die attach material. Related devices and fabrication methods are also discussed.
1. A semiconductor device package, comprising:
a substrate;
a semiconductor die comprising silicon (Si), silicon carbide (SiC), or diamond; and
a metal layer on a surface of the semiconductor die, the metal layer comprising a bonding surface that is attached to a surface of the substrate, wherein, in plan view, the bonding surface comprises opposing edges that extend along a perimeter of the semiconductor die and one or more non-orthogonal corners.
2. The semiconductor device package of claim 1 , wherein the one or more non-orthogonal corners comprise radiused or chamfered corners.
3. The semiconductor device package of claim 2 , wherein the radiused or chamfered corners have a radius of curvature or chamfer dimension, respectively, of about 100 microns or more.
4. The semiconductor device package of claim 1 , wherein the bonding surface is attached to the surface of the substrate by a die attach material, and wherein the one or more non-orthogonal corners are configured to reduce stress at an interface between the bonding surface and the die attach material.
5. The semiconductor device package of claim 4 , wherein an elastic modulus of the semiconductor die is greater than that of the die attach material by about 1.5 times or more.
6. The semiconductor device package of claim 4 , wherein a thickness of the semiconductor die is less than about 100 microns, wherein a thickness of the metal layer is less than about 10 microns, and wherein a thickness of the die attach material is less than the thickness of metal layer.
7. The semiconductor device package of claim 4 , wherein the metal layer and/or the die attach material comprise gold (Au) or an alloy thereof, and wherein the surface of the substrate comprises a die attach pad comprising copper (Cu) or an alloy or composite thereof.
8. The semiconductor device package of claim 2 , wherein the surface of the semiconductor die including the metal layer thereon comprises radiused or chamfered corners that are aligned with the radiused or chamfered corners of the bonding surface.
9. The semiconductor device package of claim 8 , wherein opposing edges and the radiused or chamfered corners of the semiconductor die comprise laser-ablated edges and corners, respectively.
10. The semiconductor device package of claim 1 , wherein the bonding surface comprises a substantially planar surface extending in first and second directions, and the one or more non-orthogonal corners are radiused or chamfered in the first and second directions.
11. The semiconductor device package of claim 3 , wherein the radius of curvature or chamfer dimension is about 100 microns to about 200 microns, or about 200 microns to about 300 microns.
12. A semiconductor device package, comprising:
a substrate;
a semiconductor die comprising silicon (Si), silicon carbide (SiC), or diamond; and
a metal layer on a surface of the semiconductor die, the metal layer comprising a bonding surface that is attached to a surface of the substrate, the bonding surface comprising opposing edges that extend along a perimeter of the semiconductor die and one or more non-orthogonal corners,
wherein the opposing edges of the bonding surface extend along the perimeter of the semiconductor die at a distance of less than 25 microns therefrom, and wherein the perimeter is defined by scribe lines that are free of the metal layer.
13. A semiconductor device package, comprising:
a substrate;
a die comprising a semiconductor material having an elastic modulus of greater than 100 gigapascals (GPa); and
a metal layer on a surface of the die and comprising a bonding surface that is attached to a surface of the substrate, wherein, in plan view, the bonding surface comprises opposing edges that extend along a perimeter of the die and one or more radiused or chamfered corners.
14. The semiconductor device package of claim 13 , wherein the one or more radiused or chamfered corners have a radius of curvature or chamfer dimension, respectively, of about 100 microns or more.
15. The semiconductor device package of claim 13 , wherein the opposing edges of the bonding surface extend along the perimeter of the die at a distance of less than 25 microns therefrom.
16. The semiconductor device package of claim 13 , wherein the bonding surface is attached to the surface of the substrate by a die attach material, and wherein the one or more radiused or chamfered corners are configured to reduce stress at an interface between the bonding surface and the die attach material.
17. The semiconductor device package of claim 16 , wherein an elastic modulus of the semiconductor material is greater than that of the die attach material by about 1.5 times or more.
18. The semiconductor device package of claim 16 , wherein the semiconductor material comprises silicon (Si) or gallium nitride (GaN), wherein the metal layer and/or the die attach material comprise gold (Au) or an alloy thereof, and wherein the surface of the substrate comprises a die attach pad comprising copper (Cu) or an alloy or composite thereof.
19. The semiconductor device package of claim 18 , wherein the surface of the die including the metal layer thereon comprises radiused or chamfered corners that are aligned with the radiused or chamfered corners of the bonding surface.
20. The semiconductor device package of claim 19 , wherein opposing edges and the radiused or chamfered corners of the die comprise laser-ablated edges and corners, respectively.
21. The semiconductor device package of claim 13 , wherein the bonding surface comprises a substantially planar surface extending in first and second directions, and the radiused or chamfered corners are radiused or chamfered in the first and second directions.
22. The semiconductor device package of claim 14 , wherein the radius of curvature or chamfer dimension is about 100 microns to about 200 microns, or about 200 microns to about 300 microns.
23. A semiconductor device package, comprising:
a substrate;
a die comprising a semiconductor material; and
a metal layer on a surface of the die and comprising a bonding surface having radiused or chamfered corners in plan view, wherein the bonding surface is attached to a surface of the substrate by a die attach material, and wherein an elastic modulus of the semiconductor material is greater that of the die attach material by about 1.5 times or more.
24. The semiconductor device package of claim 23 , wherein the bonding surface comprises opposing edges that extend along a perimeter of the die at a distance of less than 25 microns therefrom.
25. The semiconductor device package of claim 24 , wherein the radiused or chamfered corners have a radius of curvature or chamfer dimension, respectively, of about 100 microns or more.
26. The semiconductor device package of claim 25 , wherein the radiused or chamfered corners are configured to reduce stress at an interface between the bonding surface and the die attach material.
27. The semiconductor device package of claim 26 , wherein the surface of the die including the metal layer thereon comprises laser-ablated radiused or chamfered corners that are aligned with the radiused or chamfered corners of the bonding surface.
28. The semiconductor device package of claim 23 , wherein the bonding surface comprises a substantially planar surface extending in first and second directions, and the radiused or chamfered corners are radiused or chamfered in the first and second directions.
29. The semiconductor device package of claim 25 , wherein the radius of curvature or chamfer dimension is about 100 microns to about 200 microns, or about 200 microns to about 300 microns.
30. A semiconductor device package, comprising:
a substrate; and
a semiconductor die attached to a surface of the substrate, the semiconductor die comprising a material having an elastic modulus of greater than 100 gigapascals (GPa),
wherein, in plan view, a surface of the semiconductor die adjacent the surface of the substrate comprises radiused or chamfered corners.
31. The semiconductor device package of claim 30 , wherein the material comprises silicon (Si), silicon carbide (SiC), or diamond, and wherein the radiused or chamfered corners are laser-ablated.
32. The semiconductor device package of claim 30 , further comprising:
a metal layer on the surface of the semiconductor die, the metal layer comprising a bonding surface having radiused or chamfered corners that are aligned with the radiused or chamfered corners of the surface of the semiconductor die.
33. The semiconductor device package of claim 30 , wherein the surface of the semiconductor die comprises a substantially planar surface extending in first and second directions, and the radiused or chamfered corners are radiused or chamfered in the first and second directions.