Patent Assignment
Reel/Frame 053447/0532
Assignment of Assignor's Interest
Recorded: 2020-08-10
Pages: 6
Assignors
KIM, DONGHO
Executed: 2020-07-13
SHIM, JONGBO
Executed: 2020-07-13
PARK, HWANPIL
Executed: 2020-07-13
LEE, JANGWOO
Executed: 2020-07-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having a Dam Structure