Patent Assignment
Reel/Frame 053459/0356
Assignment of Assignor's Interest
Recorded: 2020-08-11
Pages: 5
Assignors
CHEN, CHUN-YUAN
Executed: 2020-06-02
SU, HUAN-CHIEH
Executed: 2020-06-02
CHUANG, CHENG-CHI
Executed: 2020-06-02
LIN, YU-MING
Executed: 2020-06-02
WANG, CHIH-HAO
Executed: 2020-06-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices with Backside Air Gap Dielectric