Patent Assignment
Reel/Frame 053463/0962
Assignment of Assignor's Interest
Recorded: 2020-08-12
Pages: 6
Assignors
OU, WEN-CHIA
Executed: 2020-08-10
HUANG, CHIH-CHAO
Executed: 2020-08-10
WEI, MIN-CHIH
Executed: 2020-08-10
CHEN, YU-TING
Executed: 2020-08-10
LIU, CHI-CHING
Executed: 2020-08-10
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK,, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same