Patent Assignment
Reel/Frame 053466/0627
Assignment of Assignor's Interest
Recorded: 2020-08-12
Pages: 6
Assignors
ODA, DAIZO
Executed: 2020-06-11
YAMADA, TAKASHI
Executed: 2020-06-11
ETO, MOTOKI
Executed: 2020-06-11
HAIBARA, TERUO
Executed: 2020-06-11
UNO, TOMOHIRO
Executed: 2020-06-23
Assignees
NIPPON MICROMETAL CORPORATION
158-1 OAZA SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 358-0032, JAPAN
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
13-1, NIHONBASHI 1-CHOME, CHUO-KU, TOKYO, 103-0027, JAPAN
Covered Property
(1)
Bonding Wire for Semiconductor Device