Patent Assignment
Reel/Frame 053479/0961
Assignment of Assignor's Interest
Recorded: 2020-08-12
Pages: 5
Assignors
WANG, SHIH-HUI
Executed: 2020-08-07
YEH, DER-CHYANG
Executed: 2020-08-07
TAI, SHIH-PENG
Executed: 2020-08-07
LIN, TSUNG-SHU
Executed: 2020-08-10
HUANG, YI-CHUNG
Executed: 2020-08-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof