Package structure and manufacturing method thereof
A package structure including a substrate, a semiconductor device, a heat spreader, and an adhesive layer is provided. The semiconductor device is bonded onto the substrate, wherein an angle θ is formed between one sidewall of the semiconductor device and one sidewall of the substrate, 0°<θ<90°. The heat spreader is disposed over the substrate, wherein the semiconductor device is disposed between the heat spreader and the substrate. The adhesive layer is surrounding the semiconductor device and attaching the heat spreader onto the substrate, wherein the adhesive layer has a first opening misaligned with one of corners of the semiconductor device closest to the first opening.
1. A package structure comprising:
a semiconductor device bonded onto a substrate having a first side, a second side and a third side opposite to the second side, wherein an angle θ is formed between one sidewall of the semiconductor device and the first side of the substrate, 0°<θ<90°;
a heat spreader disposed over the substrate, wherein the semiconductor device is disposed between the heat spreader and the substrate; and
an adhesive layer surrounding the semiconductor device and attaching the heat spreader onto the substrate, wherein the adhesive layer has a first portion, a second portion and a first opening between the first portion and the second portion, the first portion is continuously disposed along the first side and the second side, the second portion is continuously disposed along the first side and the third side, and the first opening is misaligned with one of corners of the semiconductor device closest to the first opening.
2. The package structure as claimed in claim 1 , wherein at least one of the semiconductor device and the substrate is square shape or rectangular shape.
3. The package structure as claimed in claim 1 , wherein the angle θ is about 45 degrees.
4. The package structure as claimed in claim 1 , wherein a width of the adhesive layer adjacent to the one of the corners of the semiconductor device is greater than a width of the adhesive layer adjacent to the first opening.
5. The package structure as claimed in claim 1 , wherein the heat spreader comprises:
a main portion substantially covering a top surface of the semiconductor device; and
a supporting portion between the main portion and the adhesive layer.
6. The package structure as claimed in claim 5 , wherein the main portion is substantially parallel to the top surface of the semiconductor device, and the supporting portion is substantially perpendicular to the main portion.
7. The package structure as claimed in claim 5 , wherein a bottom of the supporting portion is in contact with the adhesive layer, and a width of the bottom of the supporting portion is W and a width of the adhesive layer is ranging from 0.5 W to W.
8. The package structure as claimed in claim 1 , wherein the adhesive layer has a second opening misaligned with another one of the corners of the semiconductor device closest to the second opening.
9. The package structure as claimed in claim 1 , wherein the semiconductor device and the substrate are rectangular shape.
10. The package structure as claimed in claim 1 , wherein the one of the corners of the semiconductor device is substantially aligned with a middle of the first side of the substrate.
11. The package structure as claimed in claim 1 , further comprising a thermal interface material located between the semiconductor device and the heat spreader.
12. A package structure comprising:
a semiconductor device bonded onto a substrate, wherein the semiconductor device comprises a first sidewall, a second sidewall and a corner formed between the first and second sidewalls, the corner is nearer to a sidewall of the substrate than to other sidewalls of the substrate, wherein a shortest distance between the corner of the semiconductor device and the sidewall of the substrate is smaller than a shortest distance between each of the first sidewall and the second sidewall of the semiconductor device and the sidewall of the substrate;
an adhesive layer surrounding the semiconductor device, wherein the adhesive layer has a first opening, and the first opening is adjacent to the sidewall of the substrate and misaligned with the corner of the semiconductor device, wherein the adhesive layer includes first to fourth adhesive parts arranged in sequence, and the first to fourth adhesive parts are respectively substantially parallel with a corresponding adjacent sidewall of the substrate, wherein the first opening is disposed in the first adhesive part, and a distance between the first opening and the second adhesive part is smaller than a distance between the first opening and the fourth adhesive part, a portion of the second adhesive part is nearer to the semiconductor device than other portions of the second adhesive part, a portion of the first adhesive part is nearer to the first opening other portions of the first adhesive part, and a width of the portion of the second adhesive part adjacent to the semiconductor device is greater than a width of the portion of the first adhesive part adjacent to the first opening; and
a conductive lid attaching to the substrate by the adhesive layer.
13. The package structure as claimed in claim 12 , wherein the conductive lid comprises:
a main portion substantially covering a top surface of the semiconductor device; and
a supporting portion between the main portion and the adhesive layer, wherein a bottom of the supporting portion is in contact with the adhesive layer, and a width of the bottom of the supporting portion is W and a width of the adhesive layer is ranging from 0.5 W to W.
14. The package structure as claimed in claim 12 , wherein the third adhesive part has a second opening, wherein a distance between the second opening and the second adhesive part is larger than a distance between the second opening and the fourth adhesive part.
15. A package structure comprising:
a semiconductor device bonded onto a substrate, wherein an angle θ is formed between one sidewall of the semiconductor device and one sidewall of the substrate, 0°<θ<90°;
a heat spreader disposed over the substrate, wherein the semiconductor device is disposed between the heat spreader and the substrate; and
an adhesive layer surrounding the semiconductor device and attaching the heat spreader onto the substrate, wherein the adhesive layer has a first opening misaligned with one of corners of the semiconductor device closest to the first opening, and a width of the adhesive layer adjacent to the one of the corners of the semiconductor device is greater than a width of the adhesive layer adjacent to the first opening.
16. The package structure as claimed in claim 15 , wherein the adhesive layer comprises a ring portion and a plurality of additional portions between the ring portion and the semiconductor device, and the adhesive layer adjacent to the one of the corners of the semiconductor device comprises a part of the ring portion and one of the plurality of additional portions.
17. The package structure as claimed in claim 16 , wherein the plurality of additional portions are separated from the ring portion.
18. The package structure as claimed in claim 17 , wherein one of the plurality of additional portions has a constant width.
19. The package structure as claimed in claim 16 , wherein the plurality of additional portions are connected to the ring portion.
20. The package structure as claimed in claim 15 , wherein the width of the adhesive layer adjacent to the one of the corners of the semiconductor device decreases as the adhesive layer becomes closer to the first opening.