Patent Assignment
Reel/Frame 053551/0574
Assignment of Assignor's Interest
Recorded: 2020-08-20
Pages: 5
Assignors
FUERGUT, EDWARD
Executed: 2020-05-18
OTREMBA, RALF
Executed: 2020-05-16
ESCHER-POEPPEL, IRMGARD
Executed: 2020-08-19
GRUBER, MARTIN
Executed: 2020-05-18
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Semiconductor Package and Method of Forming a Semiconductor Package