Semiconductor package and method of forming a semiconductor package

1. A semiconductor package, comprising:

at least one semiconductor chip comprising a contact pad configured to conduct a current;

a conductor element arranged laterally overlapping the contact pad and with a distance to the contact pad;

a plurality of electrically conductive spacers;

a first adhesive system configured to electrically and mechanically connect the plurality of electrically conductive spacers with the contact pad; and

a second adhesive system configured to electrically and mechanically connect the plurality of electrically conductive spacers with the conductor element,

wherein the conductor element is electrically conductively connected to a clip or is at least part of a clip,

wherein the plurality of electrically conductive spacers is configured to electrically conductively connect the contact pad with the laterally overlapping portion of the conductor element.

2. The semiconductor package of claim 1 , wherein the plurality of electrically conductive spacers comprises a plurality of wires.

3. The semiconductor package of claim 2 , wherein a diameter of each wire of the plurality of wires is in a range from 20 μm to 600 μm.

4. The semiconductor package of claim 2 , wherein the plurality of wires is spring-loaded.

5. The semiconductor package of claim 1 , wherein the plurality of electrically conductive spacers comprises a plurality of electrically conductive cylinders.

6. The semiconductor package of claim 5 , wherein each cylinder of the plurality of electrically conductive cylinders has a diameter in a range from about 60 μm to about 350 μm.

7. The semiconductor package of claim 6 , further comprising:

electrically insulating material arranged to fill a space between the plurality of electrically conductive spacers.

8. The semiconductor package of claim 1 , wherein the clip is exposed.

9. The semiconductor package of claim 1 , wherein the first adhesive system and/or the second adhesive system comprises a solder, an electrically conductive glue, a sinter material, a bonding material, a welding material, or a press contact.

10. The semiconductor package of claim 9 , wherein the first adhesive system and/or the second adhesive system comprises a ball bond.

11. The semiconductor package of claim 9 , wherein the second adhesive system is of a same type as the first adhesive system.

12. The semiconductor package of claim 1 , wherein a material of the plurality of electrically conductive spacers comprises at least one electrically conductive material selected from the group consisting of: copper; aluminum; gold; silver; nickel; iron; palladium; and alloys thereof.

13. The semiconductor package of claim 1 , wherein the laterally overlapping portion of the conductor element is part of a plane conductor plate that is attached to a bent portion of the conductor element forming external contacts of the semiconductor package.

14. A method of forming a semiconductor package comprising at least one semiconductor chip having a contact pad configured to conduct a current, the method comprising;

electrically and mechanically connecting a plurality of electrically conductive spacers with the contact pad using a first adhesive system;

arranging a conductor element laterally overlapping the contact pad and with a distance to the contact pad; and

electrically and mechanically connecting the plurality of electrically conductive spacers with the conductor element,

wherein the conductor element is electrically conductively connected to a clip or is at least part of a clip,

wherein the plurality of electrically conductive spacers is configured to electrically conductively connect the contact pad with the laterally overlapping portion of the conductor element.

15. The method of claim 14 , wherein the plurality of electrically conductive spacers comprises a plurality of wires.

16. The method of claim 15 , further comprising:

compressing the plurality of wires with a mold tool, such that the plurality of wires is spring-loaded; and

encapsulating at least the plurality of wires.

17. The method of claim 14 , wherein the plurality of electrically conductive spacers comprises a plurality of electrically conductive cylinders.

18. The method of claim 17 , wherein each cylinder of the plurality of electrically conductive cylinders has a diameter in a range from about 60 μm to about 350 μm.

19. The method of claim 14 , further comprising:

filling a space between the plurality of electrically conductive spacers with an electrically insulating material.

20. The method of claim 14 , wherein electrically and mechanically connecting the plurality of electrically conductive spacers with the contact pad and/or electrically and mechanically connecting the plurality of electrically conductive spacers with the conductor element comprises soldering, gluing, sintering, bonding, or welding.

21. The method of claim 20 , wherein electrically and mechanically connecting the plurality of electrically conductive spacers with the contact pad and/or electrically and mechanically connecting the plurality of electrically conductive spacers with the conductor element comprises ball bonding.

22. The method of claim 14 , wherein the laterally overlapping portion of the conductor element is part of a plane conductor plate that is attached to a bent portion of the conductor element forming external contacts of the semiconductor package.

23. The method of claim 14 , wherein electrically and mechanically connecting the plurality of electrically conductive spacers with the contact pad using a first adhesive system is performed while the semiconductor chip is still part of a semiconductor wafer.