Patent Assignment
Reel/Frame 053562/0652
Assignment of Assignor's Interest
Recorded: 2020-08-21
Pages: 6
Assignors
SANDOH, HIDEYUKI
Executed: 2020-07-28
YAMAHATA, ICHIRO
Executed: 2020-07-28
TABUCHI, TOMOTAKA
Executed: 2020-07-28
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 413-8580, JAPAN
Covered Property
(1)
Wafer Processing Method