Patent Assignment
Reel/Frame 053626/0336
Assignment of Assignor's Interest
Recorded: 2020-08-28
Pages: 7
Assignors
TAKAHASHI, SEIJI
Executed: 2018-11-23
SZE, JHY-JYI
Executed: 2018-11-23
CHEN, TZU-HSIANG
Executed: 2019-01-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Pixel Device on Deep Trench Isolation (Dti) Structure for Image Sensor