Patent Assignment
Reel/Frame 053661/0746
Assignment of Assignor's Interest
Recorded: 2020-09-01
Pages: 4
Assignor
GUO, LING
Executed: 2020-08-31
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
METHOD OF EVALUATING SiC SUBSTRATE, METHOD OF MANUFACTURING SiC EPITAXIAL WAFER, AND METHOD OF MANUFACTURING SiC DEVICE
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.