Patent Assignment
Reel/Frame 053679/0201
Assignment of Assignor's Interest
Recorded: 2020-09-02
Pages: 4
Assignors
LEE, CHIANG-HAO
Executed: 2020-06-08
KUO, HUNG-JUI
Executed: 2020-06-08
HO, MING-CHE
Executed: 2020-06-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package, Redistribution Structure and Method for Forming the Same