Semiconductor package, redistribution structure and method for forming the same

1. A redistribution structure for coupling an encapsulated die, the redistribution structure comprising:

a conductive pattern disposed over and electrically coupled to the encapsulated die, wherein the conductive pattern extends beyond an edge of the encapsulated die along a first extending direction which intersects a second extending direction of the edge of the encapsulated die by an angle in a top view, an impurity concentration of sulfur in the conductive pattern is less than about 0.1 ppm, and an impurity concentration of chlorine in the conductive pattern is less than about 1 ppm.

2. The redistribution structure of claim 1 , wherein the impurity concentration of sulfur in the conductive pattern ranges from about 0.01 ppm to less than about 0.1 ppm.

3. The redistribution structure of claim 1 , wherein the angle between the first extending direction of the conductive pattern and the second extending direction of the edge of the encapsulated die is an acute angle in the top view.

4. The redistribution structure of claim 1 , wherein the conductive pattern comprises a plated conductive layer overlying a seed layer, the plated conductive layer comprises a plurality of crystal grains with an average grain size larger than 0.5 μm.

5. The redistribution structure of claim 1 , wherein a surface roughness of the conductive pattern ranges from about 100 nm to about 180 nm.

6. The redistribution structure of claim 1 , wherein the sum of impurity concentration in the conductive pattern is less than about 150 ppm.

7. A semiconductor package, comprising:

a semiconductor die encapsulated by an insulating encapsulation;

a through insulating via disposed aside the semiconductor die and penetrating through the insulating encapsulation; and

a redistribution circuitry coupling the semiconductor die to the through insulating via, the redistribution circuitry comprising an average grain size greater than an average grain size of the through insulating via for a given thickness.

8. The semiconductor package of claim 7 , wherein an impurity concentration of a plated conductive layer of the redistribution circuitry is less than that of a plated conductive layer of the through insulating via.

9. The semiconductor package of claim 8 , wherein an impurity concentration of sulfur in the plated conductive layer of the redistribution circuitry is less than about 0.1 ppm.

10. The semiconductor package of claim 8 , wherein an impurity concentration of chlorine in the plated conductive layer of the redistribution circuitry is less than about 1 ppm.

11. The semiconductor package of claim 7 , wherein the redistribution circuitry extends over the semiconductor die along a first extending direction and beyond an interface of the semiconductor die and the insulating encapsulation to be disposed over the insulating encapsulation, and the first extending direction of the redistribution circuitry is tilted with respect to a second extending direction of the interface by an angle in a top view.

12. The semiconductor package of claim 7 , wherein the angle between the first extending direction of the redistribution circuitry and the second extending direction of the interface is an acute angle.

13. The semiconductor package of claim 7 , wherein a mass density of a plated conductive layer of the redistribution circuitry is lower than that of a plated conductive layer of the through insulating via.

14. The semiconductor package of claim 13 , wherein the mass density of the plated conductive layer of the redistribution circuitry ranges from about 5.5 g/cm 3 to about 6.7 g/cm 3 .