Patent Assignment
Reel/Frame 053721/0609
Assignment of Assignor's Interest
Recorded: 2020-09-09
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing Semiconductor Package