Semiconductor package and method of manufacturing semiconductor package

1. A semiconductor package, comprising:

a package substrate;

a processor chip mounted on the package substrate;

a first stack structure on the package substrate, the first stack structure including a number M of memory chips stacked on the processor chip, M being the number of all memory chips in the first stack structure; and

a second stack structure on the package substrate and spaced apart from the processor chip, the second stack structure including a number N of memory chips stacked on the package substrate, N being the number of all memory chips in the second stack structure,

wherein a number Q of channels that electrically connect the memory chips of the second stack structure with the processor chip is greater than a number P of channels that electrically connect the memory chips of the first stack structure with the processor chip, or the number N of memory chips included in the second stack structure is greater than the number M of memory chips included in the first stack structure,

wherein M, N, P, and Q are positive non-zero integers,

wherein the number N of all memory chips in the second stack structure is greater than the number M of all memory chips in the first stack structure, and

wherein the semiconductor package contains a total number of memory chips that equals M+N.

2. The semiconductor package as claimed in claim 1 , wherein the processor chip is adhered onto the package substrate by an adhesive member.

3. The semiconductor package as claimed in claim 2 , wherein chip pads of the processor chip are electrically connected to substrate pads of the package substrate by bonding wires.

4. The semiconductor package as claimed in claim 2 , wherein a thickness of the processor chip is within a range of from 40 μm to 60 μm, and a thickness of the adhesive member is within a range of from 15 μm to 25 μm.

5. The semiconductor package as claimed in claim 1 , wherein the first stack structure includes a plurality of first memory chips sequentially stacked on the processor chip, and a thickness of the lowermost first memory chip of the plurality of first memory chips is greater than a thickness of others of the plurality of first memory chips.

6. A semiconductor package, comprising:

a package substrate;

a semiconductor chip mounted on the package substrate;

a first stack structure on the package substrate, the first stack structure including a plurality of memory chips stacked on the semiconductor chip;

a second stack structure on the package substrate and spaced apart from the semiconductor chip, the second stack structure including a plurality of memory chips stacked on the package substrate; and

a molding member on the package substrate and covering the semiconductor chip, the first stack structure, and the second stack structure,

wherein the memory chips of the first stack structure are electrically connected to the semiconductor chip through the package substrate by a number P of channels, and the memory chips of the second stack structure are electrically connected to the semiconductor chip through the package substrate by a number Q of channels,

wherein the number Q of channels connected to the memory chips of the second stack structure is greater than the number P of channels connected to the memory chips of the first stack structure,

wherein P and Q are positive non-zero integers, and

wherein a total number of bonding wires extending directly between the package substrate and the memory chips in the second stack structure is greater than a total number of bonding wires extending directly between the package substrate and the memory chips in the first stack structure.

7. The semiconductor package as claimed in claim 6 , wherein a total number M of memory chips included in the second stack structure is greater than a total number N of memory chips included in the first stack structure, and

wherein the semiconductor package contains a total number of memory chips that equals M+N.

8. The semiconductor package as claimed in claim 6 , wherein the first stack structure includes a plurality of first memory chips sequentially stacked on the semiconductor chip, and a thickness of the lowermost first memory chip of the plurality of first memory chips is greater than a thickness of others of the plurality of first memory chips.

9. A semiconductor package, comprising:

a package substrate;

a logic chip mounted on the package substrate;

a first stack structure on the package substrate, the first stack structure including a plurality of memory chips stacked on the logic chip; and

a second stack structure on the package substrate and spaced apart from the logic chip, the second stack structure including a plurality of memory chips stacked on the package substrate,

wherein the memory chips of the first stack structure are electrically connected to the logic chip through the package substrate by a total number P of channels, and the memory chips of the second stack structure are electrically connected to the logic chip through the package substrate by a total number Q of channels,

wherein a total number N of memory chips included in the second stack structure is greater than a total number M of memory chips included in the first stack structure, and

wherein P and Q are positive non-zero integers, Q is greater than P, M is an integer multiple of P, and N is an integer multiple of Q.

10. The semiconductor package as claimed in claim 9 , wherein the logic chip is adhered onto the package substrate by an adhesive member.

11. The semiconductor package as claimed in claim 9 , wherein a thickness of the logic chip is within a range of from 50 μm to 70 μm.

12. The semiconductor package as claimed in claim 9 , wherein a total number of bonding wires extending directly between the package substrate and the memory chips in the second stack structure is greater than a total number of bonding wires extending directly between the package substrate and the memory chips in the first stack structure.