Patent Assignment
Reel/Frame 053735/0225
Assignment of Assignor's Interest
Recorded: 2020-09-10
Pages: 2
Assignors
TOMORI, NAOKI
Executed: 2020-07-03
NAGOYA, TOMOHIRO
Executed: 2020-07-03
KURODA, TAKAHIRO
Executed: 2020-07-03
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Temporary Protective Film for Semiconductor Sealing Molding, Lead Frame with Temporary Protective Film, Sealed Molded Body with Temporary Protective Film, and Method for Producing Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →