Patent Assignment
Reel/Frame 053769/0513
Assignment of Assignor's Interest
Recorded: 2020-09-15
Pages: 4
Assignee
NIPPON MEKTRON, LTD.
12-15, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8585, JAPAN
Covered Property
(1)
Method for Manufacturing Substrate for Flexible Printed Wiring Board, and Substrate for Flexible Printed Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.