Patent Assignment
Reel/Frame 069464/0771
Change of Name
Recorded: 2024-11-30
Pages: 16
Assignor
NIPPON MEKTRON, LTD.
Executed: 2024-07-01
Assignee
MEKTEC CORPORATION
1-12-15, SHIBA-DAIMON, MINATO-KU, TOKYO, 105-8585, JAPAN
Covered Properties
(54)
Support Member and Battery Module
Adhesive Film and Flexible Printed Circuit Board
Flexible Printed Wiring Board with Crimp Terminal
Cylindrical Heater
Temperature Measurement Device
Method for Manufacturing Printed Circuit Board with Electronic Component, and Printed Circuit Board with Electronic Component
Gasket-Equipped Flexible Printed Wiring Board and Method for Manufacturing Gasket-Equipped Flexible Printed Wiring Board
Application:
18/169,103 →
Publication:
US 2023/0411900
Flexible Printed Wiring Board and Electric Wiring
Battery Monitoring Module and Flexible Printed Wiring Board
Application:
18/186,868 →
Publication:
US 2023/0395878
Temperature Measurement Device
Biological Information Acquisition System and Electrode Sheet
Component Mounting Board
Application:
18/569,583 →
Publication:
US 2024/0292532
Component Mounting Substrate
Application:
18/557,526 →
Publication:
US 2024/0213136
Diaper Sensor, Disposable Diaper, and Disposable Diaper Kit
Application:
18/563,658 →
Publication:
US 2024/0285444
Temperature Measurement Device for Attachment to a Housing, for Example, a Battery Case
Application:
18/364,054 →
Publication:
US 2024/0068885
Component Mount Board
Flexible Printed Board and Flexible Printed Board Connection Structure
Application:
18/481,201 →
Publication:
US 2024/0179840
Connector-Equipped Flexible Printed Circuit Board
Application:
18/481,690 →
Publication:
US 2024/0213698
Voltage Monitoring Module and Battery Unit
Flexible Printed Circuit Connection Structure
Electronic Equipment Sealing Structure and Method for Manufacturing the Same
Battery and Flexible Printed Circuit Board
Application:
18/444,608 →
Publication:
US 2024/0283037
Flexible Transparent Wiring Board and Method for Manufacturing Flexible Transparent Wiring Board
Application:
18/738,547 →
Publication:
US 2025/0056728
Wiring Unit
Application:
18/736,466 →
Publication:
US 2025/0015523
Wiring Module
Application:
18/898,588 →
Publication:
US 2025/0210822
Substrate Inspection Device and Substrate Manufacturing Method
Joining Structure of Thin Metal Plate and Base Material, and Welding Method of Thin Metal Plate and Base Material
Ultrasonic Bonding Jig, Bonding Structure, and Bonding Method
Ultrasonic Bonding Jig, Ultrasonic Bonding Method, and Bonding Structure
Ultrasonic Bonding Jig, Ultrasonic Bonding Method, and Bonding Structure
Receiver and Receiving System
Attachment Tag and Tag System
Wetting Sensor and Wetting Sensing System
Stretchable Circuit Board and Stretchable Circuit Board Manufacturing Method
Stretchable Circuit Board and Stretchable Circuit Board Manufacturing Method
Flexible Printed Board and Method for Manufacturing Flexible Printed Board
Catheter Flexible Printed Wiring Board and Method for Manufacturing the Same
Method for Manufacturing Multilayer Printed Circuit Board
Printed Wiring Board for High Frequency Transmission
Stretchable Wiring Board and Electrical Muscle Stimulating Device
Method for Manufacturing Substrate for Flexible Printed Wiring Board, and Substrate for Flexible Printed Wiring Board
Printed Circuit Board and Method for Manufacturing Same
Printed-Circuit Board
Flexible Printed Circuit Board and Battery Module
Heater Having Flexible Printed Wiring Board and Method for Manufacturing Same
Flexible Printed Circuit Board and Battery Module
Wiring Body and Method for Manufacturing Same
Wiring Material and Battery Module
Temperature Measuring Device
Stretchable Circuit Board
Method for Forming Through-Hole, and Substrate for Flexible Printed Wiring Board
Voltage Monitoring Module
Crimp Terminal-Equipped Flexible Printed Circuit Board and Method for Manufacturing Same
Flexible Printed Circuit Board with Connection Terminal, and Method for Manufacturing the Same
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 12, 2021
From: OBA, HISAE; KOMORI, HIROYUKI; SUZUKI, NOZOMU
To: NIPPON MEKTRON, LTD.
Reel/Frame 055246/0449 →
Assignment of Assignor's Interest
Feb 23, 2021
From: YAMADA, SHUZO; MIURA, YU; KANAYAMA, TOMOKI
To: NIPPON MEKTRON, LTD.
Reel/Frame 055364/0602 →
Assignment of Assignor's Interest
Mar 12, 2021
From: TOMITA, SHUNSUKE; KANAYAMA, TOMOKI
To: NIPPON MEKTRON, LTD.
Reel/Frame 055580/0859 →
Assignment of Assignor's Interest
Jun 16, 2021
From: HAYASHI, TATSURO; SEKI, SHOTA; IWAKI, HIROKAZU; SASAKI, TAKASHI
To: NIPPON MEKTRON, LTD.
Reel/Frame 056563/0228 →
Assignment of Assignor's Interest
Mar 2, 2022
From: TOMITA, SHUNSUKE; KANAYAMA, TOMOKI; KOMURO, YUKI; HASHIMOTO, YUSUKE
To: NIPPON MEKTRON, LTD.
Reel/Frame 059148/0731 →
Assignment of Assignor's Interest
Jun 8, 2022
From: ZHU, JIANG; OBUCHI, SHOTA
To: NIPPON MEKTRON, LTD.
Reel/Frame 060142/0490 →
Assignment of Assignor's Interest
Feb 14, 2023
From: SASAKI, TAKASHI; INOUE, EIICHI
To: NIPPON MEKTRON, LTD.
Reel/Frame 062697/0380 →
Assignment of Assignor's Interest
Mar 1, 2023
From: AOYAMA, SHUNSUKE; HIRATA, MASANORI
To: NIPPON MEKTRON, LTD.
Reel/Frame 062847/0272 →
Assignment of Assignor's Interest
Mar 20, 2023
From: SHIROTA, KATSUHITO; KANAYAMA, TOMOKI; YAMADA, SHUZO
To: NIPPON MEKTRON, LTD.
Reel/Frame 063039/0158 →
Assignment of Assignor's Interest
Mar 30, 2023
From: TOMITA, SHUNSUKE; NAKAYAMA, KENICHI; KANAYAMA, TOMOKI
To: NIPPON MEKTRON, LTD.
Reel/Frame 063167/0244 →
Assignment of Assignor's Interest
Jun 5, 2023
From: NAKAMURA, SOUSUKE; IWASE, MASAYUKI
To: HOSEI UNIVERSITY; NIPPON MEKTRON, LTD.
Reel/Frame 063857/0301 →
Assignment of Assignor's Interest
Aug 2, 2023
From: SHIROTA, KATSUHITO; KOMURO, YUKI; KANAYAMA, TOMOKI
To: NIPPON MEKTRON, LTD.
Reel/Frame 064469/0156 →
Assignment of Assignor's Interest
Sep 18, 2023
From: TOMINAGA, AZUMI
To: NIPPON MEKTRON, LTD.
Reel/Frame 064932/0944 →
Assignment of Assignor's Interest
Oct 4, 2023
From: HIRATA, MASANORI; MIYAMOTO, GARO; AOYAMA, SHUNSUKE
To: NIPPON MEKTRON, LTD.
Reel/Frame 065128/0298 →
Assignment of Assignor's Interest
Oct 4, 2023
From: HOSOKAWA, TAKUYA; KIYA, KENJI; KANAYAMA, TOMOKI
To: NIPPON MEKTRON, LTD.
Reel/Frame 065123/0326 →
Assignment of Assignor's Interest
Oct 5, 2023
From: YAMADA, SHUZO; NAKAYAMA, KENICHI; KANAYAMA, TOMOKI
To: NIPPON MEKTRON, LTD.
Reel/Frame 065141/0772 →
Assignment of Assignor's Interest
Oct 5, 2023
From: YAMADA, SHUZO; KANAYAMA, TOMOKI; ONO, TASUKU
To: NIPPON MEKTRON, LTD.
Reel/Frame 065138/0306 →
Assignment of Assignor's Interest
Oct 26, 2023
From: TOMINAGA, AZUMI
To: NIPPON MEKTRON, LTD.
Reel/Frame 065361/0102 →
Assignment of Assignor's Interest
Nov 22, 2023
From: TOMINAGA, AZUMI; NAKADA, KYOSUKE
To: NIPPON MEKTRON, LTD.; NOK CORPORATION
Reel/Frame 065648/0359 →
Assignment of Assignor's Interest
Dec 12, 2023
From: TOMINAGA, AZUMI
To: NIPPON MEKTRON, LTD.
Reel/Frame 065849/0840 →
Assignment of Assignor's Interest
Apr 14, 2026
From: MEKTEC CORPORATION
To: NOK CORPORATION
Reel/Frame 074355/0569 →