Granted Patent B2

US 12,250,777 · App. 17/835,798 · Granted Mar 11, 2025

Inventors: Jiang Zhu (Tokyo, JP); Shota Obuchi (Tokyo, JP)

Assignee: MEKTEC CORPORATION

H05K3/28H05K1/181

Abstract

Claims (29)

1. A method for manufacturing a printed circuit board with electronic component, comprising:

mounting an electronic component on an insulating substrate;

applying an insulating first coating resin to at least a part of the electronic component;

curing the first coating resin;

applying an insulating second coating resin to the cured first coating resin, wherein a step is formed by the insulating second coating resin at a boundary between the insulating first coating resin and the insulating second coating resin; and

curing the second coating resin.

2. The method for manufacturing the printed circuit board with electronic component according to claim 1 , wherein

the electronic component is a square surface mount component, and

the first and second coating resins are applied to coat the entire square surface mount component.

3. The method for manufacturing the printed circuit board with electronic component according to claim 1 , wherein

the electronic component has a lead terminal, and

the first and second coating resins are applied to coat at least the lead terminal.

4. The method for manufacturing the printed circuit board with electronic component according to claim 1 , wherein the insulating first coating resin and the insulating second coating resin are electrically insulating.

5. A method for manufacturing a printed circuit board with electronic component, comprising:

mounting an electronic component on an insulating substrate;

applying an insulating first coating resin to at least a part of the electronic component;

curing the first coating resin;

applying an insulating second coating resin to the cured first coating resin, wherein a range in which the second coating resin is applied is a region inside an outline of the cured first coating resin in a plan view; and

curing the second coating resin.

6. A printed circuit board with electronic component, comprising:

an insulating substrate;

an electronic component mounted on the substrate; and

an insulating coating resin layer, wherein

the coating resin layer has a main portion covering at least a part of the electronic component and a sub-portion arranged around the main portion, and

a film thickness of the main portion is larger than that of the sub-portion, and a step is formed by the main portion at a boundary between the main portion and the sub-portion.

7. The printed circuit board with electronic component according to claim 6 , wherein a thickness of the step is larger than that of the sub-portion.

8. The printed circuit board with electronic component according to claim 6 , wherein the insulating coating resin layer is electrically insulating.

9. The printed circuit board with electronic component according to claim 6 , wherein the sub-portion extends outwardly from the step.

10. The printed circuit board with electronic component according to claim 6 , wherein the sub-portion extends outwardly from the step from a lower surface of the step.

Assignments (2)

Priority Claims (1)

Continuity (1)

References Cited (48)